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FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC2R2GGT 2.2μH 2% 20 2.8
FHW1008UC2R2JGT 2.2μH 5% 20 2.8
FHW0805UC2R2KGT 2.2μH 10% 16 4.2
FHW0805UC2R2JGT 2.2μH 5% 16 4.2
FHW1008UC2R0KGT 2.0μH 10% 20 2.8
FHW1008UC2R0GGT 2.0μH 2% 20 2.8
FHW1008UC2R0JGT 2.0μH 5% 20 2.8
FHW1210HC1R8GGT 1.8μH 2% 30 2.25
FHW1210HC1R8JGT 1.8μH 5% 30 2.25
FHW1210HC1R8KGT 1.8μH 10% 30 2.25
FHW1008UC1R8GGT 1.8μH 2% 28 2.6
FHW1008UC1R8JGT 1.8μH 5% 28 2.6
FHW1008UC1R8KGT 1.8μH 10% 28 2.6
FHW0805UC1R8JGT 1.8μH 5% 18 3.8
FHW0805UC1R8KGT 1.8μH 10% 18 3.8
A total of 49 page 735 data
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