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FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC6N2JGT 6.2nH 5% 50 0.11
FHW0805UC6N2GGT 6.2nH 2% 50 0.11
FHW0805UC6N2KGT 6.2nH 10% 50 0.11
FHW0603UC6N0GST 6nH 2% 27 0.11
FHW0603UC6N0JST 6nH 5% 27 0.11
FHW0603UC6N0KST 6nH 10% 27 0.11
FHW0603UC5N6KST 5.6nH 10% 18 0.2
FHW1008UC5N6KGT 5.6nH 10% 30 0.18
FHW1008UC5N6JGT 5.6nH 5% 30 0.18
FHW0805UC5N6KGT 5.6nH 10% 50 0.065
FHW0805UC5N6GGT 5.6nH 2% 50 0.065
FHW0805UC5N6JGT 5.6nH 5% 50 0.065
FHW0805UC5N4JGT 5.4nH 5% 50 0.05
FHW0805UC5N4GGT 5.4nH 2% 50 0.05
FHW0805UC5N4KGT 5.4nH 10% 50 0.05
A total of 49 page 735 data
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