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FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC3R0JGT 3.0μH 5% 22 3.3
FHW1008UC3R0GGT 3.0μH 2% 22 3.3
FHW1210HC2R7JGT 2.7μH 5% 25 2.85
FHW1210HC2R7KGT 2.7μH 10% 25 2.85
FHW1210HC2R7GGT 2.7μH 2% 25 2.85
FHW1008UC2R7GGT 2.7μH 2% 22 3.2
FHW1008UC2R7KGT 2.7μH 10% 22 3.2
FHW1008UC2R7JGT 2.7μH 5% 22 3.2
FHW1210HC2R6JGT 2.6μH 5% 25 2.5
FHW1210HC2R6GGT 2.6μH 2% 25 2.5
FHW1210HC2R6KGT 2.6μH 10% 25 2.5
FHW1210HC2R2JGT 2.2μH 5% 30 2.41
FHW1210HC2R2GGT 2.2μH 2% 30 2.41
FHW1210HC2R2KGT 2.2μH 10% 30 2.41
FHW1008UC2R2GGT 2.2μH 2% 20 2.8
A total of 49 page 735 data
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