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FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC033GGT 33nH 2% 55 0.11
FHW1210HC033KGT 33nH 10% 55 0.11
FHW1210HC033JGT 33nH 5% 55 0.11
FHW1008UC033JGT 33nH 5% 60 0.14
FHW1008UC033GGT 33nH 2% 60 0.14
FHW1008UC033KGT 33nH 10% 60 0.14
FHW0805UC033KGT 33nH 10% 55 0.27
FHW0805UC033GGT 33nH 2% 55 0.27
FHW0805UC033JGT 33nH 5% 55 0.27
FHW0603UC030KST 30nH 10% 37 0.22
FHW0603UC030GST 30nH 2% 37 0.22
FHW0603UC030JST 30nH 5% 37 0.22
FHW0805UC030KGT 30nH 10% 55 0.26
FHW0805UC030GGT 30nH 2% 55 0.26
FHW0805UC030JGT 30nH 5% 55 0.26
A total of 49 page 735 data
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