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FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UC039KGT 39nH 10% 55 0.29
FHW0805UC039GGT 39nH 2% 55 0.29
FHW0805UC039JGT 39nH 5% 55 0.29
FHW0603UC036JST 36nH 5% 36 0.25
FHW0603UC036GST 36nH 2% 36 0.25
FHW0603UC036KST 36nH 10% 36 0.25
FHW1008UC036JGT 36nH 5% 60 0.14
FHW1008UC036KGT 36nH 10% 60 0.14
FHW1008UC036GGT 36nH 2% 60 0.14
FHW0805UC036KGT 36nH 10% 55 0.28
FHW0805UC036JGT 36nH 5% 55 0.28
FHW0805UC036GGT 36nH 2% 55 0.28
FHW0603UC033JST 33nH 5% 36 0.22
FHW0603UC033GST 33nH 2% 36 0.22
FHW0603UC033KST 33nH 10% 36 0.22
A total of 49 page 735 data
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