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FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1008UC056GGT 56nH 2% 65 0.18
FHW1008UC056JGT 56nH 5% 65 0.18
FHW1008UC056KGT 56nH 10% 65 0.18
FHW0805UC056JGT 56nH 5% 55 0.34
FHW0805UC056KGT 56nH 10% 55 0.34
FHW0805UC056GGT 56nH 2% 55 0.34
FHW0805UC054GGT 54nH 2% 55 0.34
FHW0805UC054JGT 54nH 5% 55 0.34
FHW0805UC054KGT 54nH 10% 55 0.34
FHW0805UC053KGT 53nH 10% 55 0.34
FHW0805UC053JGT 53nH 5% 55 0.34
FHW0805UC053GGT 53nH 2% 55 0.34
FHW0805UC052KGT 52nH 10% 55 0.34
FHW0805UC052JGT 52nH 5% 55 0.34
FHW0805UC052GGT 52nH 2% 55 0.34
A total of 49 page 735 data
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