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FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW1210HC6R8KGT 6.8μH 10% 20 8
FHW1008UC6R8JGT 6.8μH 5% 18 8.2
FHW1008UC6R8KGT 6.8μH 10% 18 8.2
FHW1210HC5R6KGT 5.6μH 10% 20 5
FHW1210HC5R6JGT 5.6μH 5% 20 5
FHW1008UC5R6JGT 5.6μH 5% 18 7.6
FHW1008UC5R6KGT 5.6μH 10% 18 7.6
FHW1210HC4R7KGT 4.7μH 10% 16 4
FHW1210HC4R7JGT 4.7μH 5% 16 4
FHW1008UC4R7KGT 4.7μH 10% 18 4
FHW1008UC4R7JGT 4.7μH 5% 18 4
FHW1008UC4R3KGT 4.3μH 10% 18 3.8
FHW1008UC4R3GGT 4.3μH 2% 18 3.8
FHW1008UC4R3JGT 4.3μH 5% 18 3.8
FHW1210HC3R9GGT 3.9μH 2% 20 3.6
A total of 49 page 735 data
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