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FHW Series Wire Wound Chip Ceramic Iinductors

FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceSelf-Resonant FrequencyDCR MaxDatasheet
FHW0805UCR68KGT 680nH 10% 23 2.1
FHW0805UCR68JGT 680nH 5% 23 2.1
FHW1008UCR66JGT 660nH 5% 45 1.47
FHW1008UCR66GGT 660nH 2% 45 1.47
FHW1008UCR66KGT 660nH 10% 45 1.47
FHW1210HCR62JGT 620nH 5% 45 1.2
FHW1210HCR62GGT 620nH 2% 45 1.2
FHW1210HCR62KGT 620nH 10% 45 1.2
FHW1008UCR62KGT 620nH 10% 45 1.4
FHW1008UCR62JGT 620nH 5% 45 1.4
FHW1008UCR62GGT 620nH 2% 45 1.4
FHW0805UCR62JGT 620nH 5% 23 2.08
FHW0805UCR62KGT 620nH 10% 23 2.08
FHW1210HCR60GGT 600nH 2% 45 1.2
FHW1210HCR60KGT 600nH 10% 45 1.2
A total of 49 page 735 data
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